11

LTC1772

1772fb

LTC1772 High Efficiency, Small Footprint 3.3V to 1.8V/0.5A Regulator

LTC1772

R4

10k

R1

0.15

Ω

R2

100k

R3

80.6k

L1

10

µH

M1

D1

C3

220pF

GND

6

5

4

1772 TA02

1

2

3

PGATE

C1

10

µF

10V

3.3V

1.8V

0.5A

C2

47

µF

6V

+

C1: TAIYO YUDEN CERAMIC

LMK325BJ106K-T

C2: SANYO POSCAP 6TPA47M

D1: MOTOROLA MBRM120T3

L1: COILTRONICS UP1B-100

M1: Si3443DV

R1: DALE 0.25W

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-

tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.

TYPICAL APPLICATIO

S6 Package

6-Lead Plastic TSOT-23

(Reference LTC DWG # 05-08-1636)

1.50 – 1.75

(NOTE 4)

2.80 BSC

0.30 – 0.45

6 PLCS (NOTE 3)

DATUM ‘A’

0.09 – 0.20

(NOTE 3)

S6 TSOT-23 0302

2.90 BSC

(NOTE 4)

0.95 BSC

1.90 BSC

0.80 – 0.90

1.00 MAX

0.01 – 0.10

0.20 BSC

0.30 – 0.50 REF

PIN ONE ID

NOTE:

1. DIMENSIONS ARE IN MILLIMETERS

2. DRAWING NOT TO SCALE

3. DIMENSIONS ARE INCLUSIVE OF PLATING

4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR

5. MOLD FLASH SHALL NOT EXCEED 0.254mm

6. JEDEC PACKAGE REFERENCE IS MO-193

3.85 MAX

0.62

MAX

0.95

REF

RECOMMENDED SOLDER PAD LAYOUT

PER IPC CALCULATOR

1.4 MIN

2.62 REF

1.22 REF