9

LTC2051/LTC2052

20512fd

–

+

1/2 LTC2051

–

+

A1

–

+

1/2 LTC2051

6

3

2

5

R4

R5

R3

20512 F01

R2

5V

R1

+

–

C2

C1

7

1

6

8

1

3

2

OUT

OUT

A1

R1

R2

R3

R4

R5

C1

C2

LT1677

2.49k

3.01k

340k

10k

100k

0.01μF

0.001μF

LT1012

750Ω

57Ω

250k

10k

100k

0.01μF

0.001μF

TYPICAL APPLICATIO

PACKAGE DESCRIPTIO

3.00 ±0.10

(4 SIDES)

NOTE:

1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON TOP AND BOTTOM OF PACKAGE

0.38 ± 0.10

BOTTOM VIEW—EXPOSED PAD

1.65 ± 0.10

(2 SIDES)

0.75 ±0.05

R = 0.115

TYP

2.38 ±0.10

(2 SIDES)

1

4

8

5

PIN 1

TOP MARK

(NOTE 6)

0.200 REF

0.00 – 0.05

(DD) DFN 1203

0.25 ± 0.05

2.38 ±0.05

(2 SIDES)

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

1.65 ±0.05

(2 SIDES)

2.15 ±0.05

0.50

BSC

0.675 ±0.05

3.5 ±0.05

PACKAGE

OUTLINE

0.25 ± 0.05

0.50 BSC

DD Package

8-Lead Plastic DFN (3mm × 3mm)

(Reference LTC DWG # 05-08-1698)