2

DS-CYTHRML-3.0

Altera Corporation

Altera Device Package Information Data Sheet

Cyclone III

Devices

Thermal resistance values for Cyclone III devices are provided for a board

meeting JEDEC specifications and for a typical board. The JEDEC board

specifications require two signals and two power/ground planes and are

available at www.jedec.org. The values are described in Tables 1

through 4.

Table 2 provides

a board meeting JEDEC specifications for thermal resistance calculation.

Table 1. Thermal Resistance Values for Cyclone III Devices

Value

Description

Junction-to-ambient thermal resistance (

is not being used.

Junction-to-ambient thermal resistance with 100 ft./minute airflow when a

heat sink is not being used.

Junction-to-ambient thermal resistance with 200 ft./minute airflow when a

heat sink is not being used.

Junction-to-ambient thermal resistance with 400 ft./minute airflow when a

heat sink is not being used.

Junction-to-case thermal resistance (

Junction-to-board thermal resistance (

Table 2. Thermal Resistance of Cyclone III Devices for Board Meeting JEDEC Specifications (Part 1 of 2)

Device

Package

Still Air

100 ft./min.

200 ft./min.

400 ft./min.

EP3C5

E144

20

17.5

15.4

14

8.4

F256

32.4

28.9

27

25.5

11.7

U256

32.5

29.1

27.2

25.6

12.2

M164

38.2

31.5

29.6

27.9

11.6

EP3C10

E144

20

17.5

15.4

14

8.4

F256

32.4

28.9

27

25.5

11.7

U256

32.5

29.1

27.2

25.6

12.2

M164

38.2

31.5

29.6

27.9

11.6