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SM7645DEV 데이터시트(PDF) 7 Page - Pletronics, Inc.

부품명 SM7645DEV
상세설명  3.3 V CMOS Clock Oscillators
PDF  9 Pages
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제조업체  PLETRONICS [Pletronics, Inc.]
홈페이지  http://www.pletronics.com
Logo PLETRONICS - Pletronics, Inc.

SM7645DEV 데이터시트(HTML) 7 Page - Pletronics, Inc.

  SM7645DEV Datasheet HTML 1Page - Pletronics, Inc. SM7645DEV Datasheet HTML 2Page - Pletronics, Inc. SM7645DEV Datasheet HTML 3Page - Pletronics, Inc. SM7645DEV Datasheet HTML 4Page - Pletronics, Inc. SM7645DEV Datasheet HTML 5Page - Pletronics, Inc. SM7645DEV Datasheet HTML 6Page - Pletronics, Inc. SM7645DEV Datasheet HTML 7Page - Pletronics, Inc. SM7645DEV Datasheet HTML 8Page - Pletronics, Inc. SM7645DEV Datasheet HTML 9Page - Pletronics, Inc.  
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SM76D Series 3.3 V
CMOS Clock Oscillators
March 2008
www.pletronics.com
425-776-1880
7
Mechanical (obsolete version):
The cover is no longer being supplied over this part. This part is made with a hermetically sealed SM77D
series oscillator. This part is now exposed.
The cover has been deleted as it was causing problems with the newer high temperature RoHS lead free
processes. The cover purpose was only cosmetic.
All parts ordered in 2008 will be made in the new fashion.
There is no change in electrical properties.
Pletronics does recommend that all designs should transition to the SM77D ceramic part. This is the base
part of the SM76D.
Inches
mm
Cover:
Centered on the base
304 Stainless Steel
0.010 inch (0.25μm)
Electroless Nickel Plated
1 μinch (25 μm) typical
Label:
White Kapton with Black Letters
–or--
Laser marked lettering
FR4 PCB Base:
Solder masked
All via holes tented on bottom
Copper Clad ½ oz. Typical
Gold plated 0.02 μinch (0.5 μm)
Pin 3 Ground plane is typical
Not to scale
1 Typical dimension
A
0.351 +_0.003
8.91 +_0.07
B
0.356 +_0.005
9.04 +_0.13
C
0.103 +_0.005
2.62 +_0.13
D1
0.324
8.23
E1
0.316
8.03
F1
0.050
1.27
G1
0.040
1.02
H1
0.059
1.50
I1
0.020
0.51
J1
0.040
1.02
K1
0.200
5.08
L1
0.026 typical
0.66
The package is not hermetically sealed.
The sides are intentionally left open to permit cleaning material to freely flow in the package, thus
minimizing the accumulation of contaminants during cleaning processes.
The internal part of the package must be thoroughly dry before operating.



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