Absolute Maximum Ratings

Items

Symbol

Value

Unit

Power Dissipation at Tamb=25℃

500 *

mW

Junction Temperature

175

℃

Storage Temperature Range

-65 ~ +175

℃

* Valid provided that leads at a distance of 10mm from case are kept at ambient temperature

Characteristic at Tamb=25℃

Items

Symbol

Min.

Typ.

Max.

Unit

Thermal Resistance Junctiobn to Ambient Air

R

θJA

-

-

0.3 *

K / mW

-

-

1.0

V

* Valid provided that leads at a distance of 10mm from case are kept at ambient temperature

Items

Materials

Package

Mini MELF

Case

H

Packaging Dimensions (mm)

ermeticall sealed glass

L

Symbol

Min

Max

ead Finish

Solder Plating

A

B

C

3.302

1.397

0.350

3.505

1.499

0.500

A

B

C

Mechanical Data

Dimensions in mm

MINI MELF

http://www.SeCoSGmbH.com/

Any changing of specification will not be informed individual

5

10

15

20

25

30

50

V

40

30

20

10

0

Breakdown Characteristics

ZMM55 Series

mA

Test currrent

Iz=5mA

due to the ambient temperature.

500

Change in the power dissipation

250

200

50 100 150

200

Ta (℃)

Ambient Temperature.

100

400

300

21-Aug-2007 Rev.B

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