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EMP312 데이터시트(PDF) 2 Page - Excelics Semiconductor, Inc.

부품명 EMP312
상세설명  21.0 - 24.0 GHz Power Amplifier MMIC
PDF  2 Pages
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제조업체  EXCELICS [Excelics Semiconductor, Inc.]
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Logo EXCELICS - Excelics Semiconductor, Inc.

EMP312 데이터시트(HTML) 2 Page - Excelics Semiconductor, Inc.

  EMP312 Datasheet HTML 1Page - Excelics Semiconductor, Inc. EMP312 Datasheet HTML 2Page - Excelics Semiconductor, Inc.  
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EMP312
UPDATED 04/04/2008
21.0 – 24.0 GHz Power Amplifier MMIC
Specifications are subject to change without notice.
Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085
page 2 of 2
Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com
Revised April 2008
ASSEMBLY DRAWING
The length of RF wires should be as short as possible. Use at least two wires between RF pad and 50 ohm line and
separate the wires to minimize the mutual inductance.
Chip size 2140 X 2650 microns
Chip Thickness: 75
±13 microns
PAD Dimensions: 100 x 100 microns
All Dimensions in Microns
CHIP OUTLINE



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