NOTE : Specifications subject to change without notice. Please check our website for latest information.

SUPERWORLD ELECTRONICS (S) PTE LTD

PG. 6

26.09.2008

CERAMIC CHIP INDUCTORS

C2 SERIES

C

D

temperature

A

B

b) 280°C tip temperature (max)

c) Never contact the ceramic with the iron tip

a) Preheat circuit and products to 150°C.

Accordingly increasing the solder volume, the mechanical stress to product is also

increased. Exceeding solder volume may cause the failure of mechanical or electrical

performance. Solder shall be used not to be exceed as shown in right side.

9-3. Solder Volume :

9-2. Soldering Iron

a soldering iron must be employed the following precautions are recommended.

Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that

Note :

e) Use a 30 watt max. soldering iron with tip diameter of 3.0mm

f) Limit soldering time to 3 secs.

Upper limit

Recommendable

d) 3.0mm tip diameter (max)

TIME(sec.)

(Melting area of solder)

255 ~ 260

No. of mounting

Peak temperature

Peak hold time

E

times

3

sec

°C

10 max.

main heating

pre-heating

normal

230°C

Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.

Also cooling into the solvent after soldering should be in such a way that the temperature difference is limited to 100°C max.

Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150°C max.

Products should be soldered within the following allowable range indicated by the slanted line. The excessive soldering conditions

9-1. Reflow soldering conditions

may cause the corrosion of the electrode. When soldering is repeated, allowable time is the accumulated time.

9. SOLDERING :

180°C

120°C

E

°C/sec

A

Slope of temp. rise

1 to 5

50 to 150

120 to 180

90 ~ 120

Heat temperature

Slope of temp. rise

Time over 230°C

C

D

Heat time

B

°C

°C/sec

sec

1 to 5

sec