TL084Y

JFET-INPUT QUAD OPERATIONAL AMPLIFIER

SLOS081A–D2297, FEBRUARY 1977–REVISED NOVEMBER 1992

POST OFFICE BOX 655303

POST OFFICE BOX 1443

77251–1443

5

chip information

These chips, when properly assembled, display characteristics similar to the TL084. Thermal compression or

ultrasonic bonding may be used on the doped aluminum bonding pads. Chips may be mounted with conductive

epoxy or a gold-silicon preform.

BONDING PAD ASSIGNMENTS

CHIP THICKNESS: 15 TYPICAL

BONDING PADS: 4

× 4 MINIMUM

TJmax = 150°C

TOLERANCES ARE

±10%

ALL DIMENSIONS ARE IN MILS

PIN (11) INTERNALLY CONNECTED

TO BACKSIDE OF CHIP

+

–

1 OUT

1 IN +

1 IN –

VCC+

(4)

(6)

(3)

(2)

(5)

(1)

–

+

(7)

2 IN +

2 IN –

2 OUT

(11)

VCC –

+

–

3 OUT

3 IN +

3 IN –

(13)

(10)

(9)

(12)

(8)

–

+

(14)

4 OUT

4 IN +

4 IN –