TL7702B, TL7705B

SUPPLY-VOLTAGE SUPERVISORS

SLVS037H – SEPTEMBER 1989 – REVISED JULY 1999

2

POST OFFICE BOX 655303

AVAILABLE OPTIONS

PACKAGED DEVICES

TA

SMALL

OUTLINE

(D)

CHIP

CARRIER

(FK)

CERAMIC

DIP

(JG)

PLASTIC

DIP

(P)

CERAMIC

FLATPACK

(U)

CHIP FORM

(Y)

0

°Cto70°C

TL7702BCD

—

—

TL7702BCP

—

0

°C to 70°C

TL7705BCD

—

—

TL7705BCP

—

40

°Cto85°C

TL7702BID

—

—

TL7702BIP

—

TL7702BY,

–40

°C to 85°C

TL7705BID

—

—

TL7705BIP

—

TL7702BY,

TL7705BY

–40

°C to 125°C

TL7705BQD

—

—

—

—

55

°Cto125°C

—

TL7702BMFK

TL7702BMJG

—

TL7702BMU

–55

°C to 125°C

—

TL7705BMFK

TL7705BMJG

—

TL7705BMU

The D package is available taped and reeled. Add the suffix R to device type (e.g., TL7702BCDR). Chip forms are tested at

25

°C.