TLV2711, TLV2711Y

Advanced LinCMOS

™ RAIL-TO-RAIL

MICROPOWER SINGLE OPERATIONAL AMPLIFIERS

SLOS196 – AUGUST 1997

12

POST OFFICE BOX 655303

TYPICAL CHARACTERISTICS

Figure 6

DISTRIBUTION OF TLV2711 INPUT OFFSET

VOLTAGE TEMPERATURE COEFFICIENT

αVIO – Temperature Coefficient – µV/°C

30

20

10

0

40

50

–3

–2

–1

0

1

2

3

32 Amplifiers From 1 Wafer Lot

VDD = ± 1.5 V

P Package

TA = 25°C

Figure 7

DISTRIBUTION OF TLV2711 INPUT OFFSET

VOLTAGE TEMPERATURE COEFFICIENT

αVIO – Temperature Coefficient – µV/°C

30

20

10

0

40

50

–3

–2

–1

0

1

2

3

32 Amplifiers From 1 Wafer Lot

VDD = ± 2.5 V

P Package

TA = 25°C

Figure 8

vs

FREE-AIR TEMPERATURE

TA – Free-Air Temperature – °C

50

40

20

10

0

90

30

25

45

65

85

70

60

80

100

105

125

IIB

IIO

VDD

± = ±2.5 V

VIC = 0

VO = 0

RS = 50 Ω

Figure 9

0

4

1

1.5

2

2.5

2

1

3

INPUT VOLTAGE

vs

SUPPLY VOLTAGE

5

3

3.5

4

–1

–2

–3

–4

–5

RS = 50 Ω

TA = 25°C

| VIO | ≤ 5 mV

| VDD

± | – Supply Voltage – V

† Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.