TNETE2201B

1.25-GIGABIT ETHERNET TRANSCEIVER

SLLS367A – JUNE 1999 – REVISED AUGUST 1999

17

POST OFFICE BOX 655303

MECHANICAL INFORMATION

PHD (S-PQFP-G64)

PowerPAD

™ PLASTIC QUAD FLATPACK (DIE DOWN)

Gage Plane

32

17

(see Note D)

Thermal Pad

0,13 NOM

0,75

0,25

0,45

Seating Plane

4087742/A 12/97

0,40

33

48

0,30

49

64

16

SQ

SQ

1

14,05

16,15

15,85

13,95

12,00 TYP

0,95

1,05

1,20 MAX

0,80

M

0,20

0,10

0

°–7°

0,15

0,05

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions include mold flash or protrusions.

D. The package thermal performance may be enhanced by attaching an external heat sink to the thermal pad. This pad is electrically

and thermally connected to the backside of the die and possibly selected leads.

E. Falls within JEDEC MS-026

PowerPAD is a trademark of Texas Instruments Incorporated.