TPS2014, TPS2015

POWER DISTRIBUTION SWITCHES

SLVS159B – DECEMBER 1996 – REVISED AUGUST 1997

2

POST OFFICE BOX 655303

functional block diagram

OUT

OC

IN

EN

GND

Current

Limit

Driver

UVLO

Charge

Pump

CS

Thermal

Sense

Power Switch

†

†Current Sense

TPS20xxY chip information

This chip, when properly assembled, displays characteristics similar to those of the TPS20xx. Ultrasonic

bonding may be used on the doped aluminium bonding pads. The chip may be mounted with conductive epoxy

or a gold-silicon preform.

91

74

CHIP THICKNESS: 15 TYPICAl

BONDING PADS: 4

× 4 MINIMUM

TJ max = 150°C

TOLERANCES ARE

±10%.

ALL DIMENSIONS ARE IN MILS.

OUT

OUT

OUT

OC

GND

IN

IN

EN

TPS20xxY

(1)

(2)

(3)

(4)

(8)

(7)

(6)

(5)

(1)

(2)

(3)

(4)

(5)

(6)

(7)

(8)

BONDING PAD ASSIGNMENTS