TPS2811, TPS2812, TPS2813, TPS2814, TPS2815

DUAL HIGH-SPEED MOSFET DRIVERS

SLVS132D – NOVEMBER 1995 – REVISED NOVEMBER 1997

3

POST OFFICE BOX 655303

TPS28xxY chip information

This chip, when properly assembled, displays characteristics similar to those of the TPS28xx. Thermal

compression or ultrasonic bonding may be used on the doped aluminum bonding pads. The chip may be

mounted with conductive epoxy or a gold-silicon preform.

57

BONDING PAD ASSIGNMENTS

CHIP THICKNESS: 15 MILS TYPICAL

BONDING PADS: 4

× 4 MILS MINIMUM

TJmax OPERATING TEMPERATURE = 150°C

TOLERANCES ARE

±10%.

ALL DIMENSIONS ARE IN MILS.

(7)

(6)

(1)

(5)

(2)

(3)

GND

1OUT

VCC

REG_IN

1IN

TPS2811Y

TPS2812Y

TPS2813Y

REG_OUT

(8)

(4)

2IN

47

(1)

(8)

(7)

(2)

(3)

(4)

(5)

(6)

2OUT

(6)

(5)

(1)

(4)

(2)

(8)

GND

1OUT

VCC

1IN1

1IN2

TPS2814Y

(7)

(3)

2IN1

2OUT

2IN2

(6)

(5)

(1)

(4)

(2)

(8)

GND

1OUT

VCC

1IN1

1IN2

TPS2815Y

(7)

(3)

2IN1

2OUT

2IN2