PACKAGE DISSIPATION RATINGS

RECOMMENDED OPERATING CONDITIONS

TPS51113, TPS51163

(1)

POWER RATING (W)

POWER RATING (W)

PACKAGE

AIRFLOW (LFM)

(°C/W)

0 (natural convection)

47.9

2.08

0.835

DRC

200

40.5

2.46

0.987

400

38.2

2.61

1.04

(1)

Ratings based on JEDEC High Thermal Conductivity (High K) Board. For more information on the test method, see TI Technical Brief

(SZZA017).

(unless otherwise noted, all voltages are with respect to GND)

MIN

TYP

MAX

UNIT

VDD

–0.1

13.2

BOOT

–0.1

28.0

BOOT, to SW (negative overshoot –5 V for t < 25 ns,

–3.0

13.2

Supply voltages

125 V × ns/t for 25 ns < t< 100 ns)

V

BOOT, (negative overshoot –5 V for t < 25 ns,

–3.0

35.0

125 V × ns/t for 25 ns < t < 100 ns)

All other pins

–0.1

3.0

SW

–0.1

20.0

SW, (negative overshoot –5 V for t < 25 ns,

–3.0

28.0

125 V × ns/t for 25 ns < t < 100 ns)

HDRV

–0.1

28.0

HDRV to SW (negative overshoot –5 V for t < 25 ns,

–3.0

13.2

125 V × ns/t for 25 ns < t< 100 ns)

Output voltages

HDRV (negative overshoot –5 V for t < 25 ns,

V

–3.0

35.0

125 V × ns/t for 25 ns < t < 100 ns)

LDRV_OC

–0.1

13.2

LDRV_OC (negative overshoot –5 V for t < 25 ns,

–3.0

13.2

125 V × ns/t for 25 ns < t < 100 ns)

PGOOD

–0.1

13.2

All other pins

–0.1

3.0

Operating ambient temperature

–40

85

°C

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