SE97TP datasheet(3/54 Pages) NXP

3 / 54 page

SE97_5

Product data sheet

Rev. 05 — 6 August 2009

3 of 54

NXP Semiconductors

SE97

DDR memory module temp sensor with integrated SPD, 3.3 V

Applications

I DDR2 and DDR3 memory modules

I Laptops, personal computers and servers

I Enterprise networking

I Hard disk drives and other PC peripherals

Ordering information

[1]

SE97TL and SE97TP offer improved VPOR/EVENT IOL.

[2]

Industry standard 2 mm

× 3mm × 0.8 mm package to JEDEC VCED-3 PSON8 in 8 mm × 4 mm pitch tape 4 k quantity reels.

Table 1.

Ordering information

Type number

Topside

mark

Package

Name

Description

Version

SE97PW

SE97

TSSOP8

plastic thin shrink small outline package; 8 leads;

body width 4.4 mm

SOT530-1

SE97TK

SE97

HVSON8

plastic thermal enhanced very thin small outline package;

no leads; 8 terminals; body 3

× 3 × 0.85 mm

SOT908-1

SE97TL[1]

97L

HXSON8

plastic thermal enhanced extremely thin small outline package;

no leads; 8 terminals; body 2

× 3 × 0.5 mm

SOT1052-1

SE97TP[1][2]

S97

HWSON8

plastic thermal enhanced very very thin small outline package;

no leads; 8 terminals; body 2

× 3 × 0.8 mm

SOT1069-1

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