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STA2065 데이터시트(PDF) 18 Page - STMicroelectronics |
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STA2065 데이터시트(HTML) 18 Page - STMicroelectronics |
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18 / 20 page ![]() Package information STA2065 18/20 Doc ID16050 Rev 1 4 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 2. TFBGA372+100 (16x16x1.2mm) mechanical data andpackage dimensions OUTLINE AND MECHANICAL DATA DIM. mm inch MIN. TYP. MAX. MIN. TYP. MAX. A 1.200 0.0472 A1 A2 0.300 0.0118 A4 0.600 0.0236 b 0.300 0.350 0.420 0.0118 0.0138 0.0165 D 16.000 0.6299 D1 14.950 0.5886 E 16.000 0.6299 E1 14.950 0.5886 e 0.650 0.0256 Z 0.530 0.0209 ddd 0.150 0.0059 eee 0.150 0.0059 fff 0.080 0.0031 TFBGA372+100 Thin profile Fine Pitch Ball Grid Array Body: 16 x 16 x 1.2mm, pitch 0.65mm 8178590 B |
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