• 4222 South Staples Street • Corpus Christi Texas 78411 USA

Wire and Film Technologies Division

Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com

Precision Power Chip

Physical Data

Size Code

Industry

Footprint

Actual Size

Dimensions (Inches and (mm))

L

W

C

B

1206

0.128 ± 0.007

(3.25 ± 0.18)

0.057 ± 0.006

(1.45 ± 0.15)

0.020 ± 0.010

(0.51 ± 0.25)

D

2010

0.200 ± 0.010

(5.08 ± 0.25)

0.079 ± 0.006

(2.01 ± 0.15)

0.030 ± 0.010

(0.761 ± 0.25)

F

2512

0.251 ± 0.010

(6.38 ± 0.25)

0.079 ± 0.006

(2.01 ± 0.15)

0.040 ± 0.010

(1.02 ± 0.25)

H

3610

0.367 ± 0.010

(9.32 ± 0.25)

0.105 ± 0.006

(2.67 ± 0.15)

0.050 ± 0.010

(1.27 ± 0.25)

Recommended Solder Pad Dimensions (Reflow):

Size

Code

Industry

Footprint

Dimensions (Inches and mm))

A

B

C

D

E

F

B

1206

0.076

(1.93)

0.093

(2.36)

0.058

(1.47)

0.098

(2.49)

0.032

(0.81)

0.211

(5.36)

D

2010

0.111

(2.82)

0.126

(3.20)

0.096

(2.44)

0.152

(3.86)

0.040

(1.02)

0.318

(8.08)

F

2512

0.121

(3.07)

0.126

(3.20)

0.127

(3.23)

0.183

(4.65)

0.040

(1.02)

0.369

(9.37)

H

3610

0.170

(4.32)

0.160

(4.06)

0.213

(5.41)

0.273

(6.93)

0.044

(1.12)

0.553

(14.05)

F

E

B

D

A

C

A

L

C

W

Recommended Solder Pad Dimensions (Reflow):

To ensure excellent solderability performance, IRC recommends the following pad design. This design will provide

a large repeatable solder fillet to the PPC resistor on reflow processes and will provide maximum heat transfert

to the PC board in high power applications. By placing the PPC on the solder paste while the paste is in the

"tacky" state, the PPC will be held in position until solder reflow begins. The pad design thes uses the surface

tension of the molten solder to pull the component to the center of the solder pad. The placement of a via rising

above the board level directly beneath the PPC is not recommended.

PPC Series Issue November 2008 Sheet 2 of 3