Product Details

DIMENSION A

DIMENSION B

DIMENSION C

DIMENSION D

INTERFACE MATERIAL

FINISH

Notes:

Dimension C = heat sink height from bottom of the base to the top of the fin field.

Thermal performance data are provided for reference only. Actual performance may vary

by application.

ATS reserves the right to update or change its products without notice to improve the

design or performance.

Contact ATS to learn about custom options available.

1)

2)

3)

4)

thermal Performance

For more information, to find a distributor or to place an order, visit www.qats.com or

call: 781.769.2800 (North America); +31 (0) 3569 84715 (Europe).

ATS PART # ATS-56009-C3-R0

Features & Benefits

High Performance ASIC Cooling

Solutions w/Thermal Tape Attachment

REV1_0908

AIR VELOCITy

THERMAL RESISTANCE

FT/MIN

M/S

°C/W (UNDUCTED FLOW)

°C/W (DUCTED FLOW)

200

1.0

300

1.5

400

2.0

500

2.5

600

3.0

700

3.5

800

4.0

4.8

3.9

3.1

2.7

2.4

2.3

2.2

2.4

58 mm

30 mm

9 mm

44.3 mm

BLACK-ANODIZED

SAINT-gOBAIN C675

maxiFLOW™ design features a low profile, spread fin

array that maximizes surface area for more effective

convection (air) cooling

Designed specifically for ASIC package and their unique

cooling requirements

Comes preassembled with high performance thermal

interface material

»

»

»

D

A

B

C

*Image above is for illustration purposes only.