Product Details

DIMENSION A

DIMENSION B

DIMENSION C

DIMENSION D

INTERFACE MATERIAL

FINISH

Notes:

Dimension C = heat sink height from bottom of the base to the top of the fin field.

Thermal performance data are provided for reference only. Actual performance may vary

by application.

ATS reserves the right to update or change its products without notice to improve the

design or performance.

Contact ATS to learn about custom options available.

1)

2)

3)

4)

thermal Performance

For more information, to find a distributor or to place an order, visit www.qats.com or

call: 781.769.2800 (North America); +31 (0) 3569 84715 (Europe).

ATS PART # ATS-57001-C1-R0

Features & Benefits

High Performance LGA Cooling

solutions

REV1_0908

AIR VELOCITy

THERMAL RESISTANCE

FT/MIN

M/S

°C/W (UNDUCTED FLOW)

°C/W (DUCTED FLOW)

200

1.0

300

1.5

400

2.0

500

2.5

600

3.0

700

3.5

800

4.0

1.01

0.81

0.7

0.62

0.57

0.52

0.48

0.6

56 mm

56 mm

31 mm

N/A mm

BLACK-ANODIZED

NO TIM

Provides high capacity cooling for high power LGAs

Unique attachment minimizes mechanical stress on the

device

Includes spring-loaded, push pin mounts for direct

attachment to the PCB

»

»

»

A

B

C

D

*Image above is for illustration purposes only.