Product Details

LENGTH

WIDTH

HEIGHT

FIN TIP to FIN TIP

INTERFACE MATERIAL

FINISH

Notes:

Length and width dimensions refer to the size of the component. Dimensions of the heat

sink are subject to tolerances of up to .99 mm in order to accommodate the clip assembly

Thermal performance data are provided for reference only. Actual performance may vary

by application

ATS reserves the right to update or change its products without notice to improve the

design or performance

Additional tooling fees may be required

Typical lead time is a minimum of 4-6 weeks

Contact ATS to learn about custom options available

1)

2)

3)

4)

5)

6)

thermal Performance

For more information, to find a distributor or to place an order, visit www.qats.com or

call: 781.769.2800 (North America); +31 (0) 3569 84715 (Europe).

ATS PART # ATS-X50230P-C1-R0

Features & Benefits

High Performance BGA Cooling

Solutions w/ superGRIP™ Attachment

REV0_042109

AIR VELoCITy

THERMAL RESISTANCE

FT/MIN

M/S

°C/W (UNDUCTED FLOW)

°C/W (DUCTED FLOW)

200

1.0

300

1.5

400

2.0

500

2.5

600

3.0

700

3.5

800

4.0

5.1

4.2

3.6

3.3

3

2.8

2.6

4.1

23 mm

23 mm

17.5 mm

41.5 mm

BLUE-ANODIZED

ChOMErICS T766

Designed for 23 x 23 mm BGA components

requires minimal space around the component’s

perimeter; ideal for densely populated PCBs

Allows the heat sink to be detached and reattached

without damaging the component or the PCB, an important

feature in the event a PCB may need to be reworked

Strong, uniform attachment force helps achieve maximum

performance from phase-changing TIMs

Eliminates the need to drill mounting holes in the PCB

Assembly comes standard with a high performance

maxiFLOW™ heat sink which maximizes convection (air)

cooling

Comes standard with clean break, reworkable, Chomerics

T-766 phase change material

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*Image above is for illustration purposes only.

FT

H

L

W