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LTM4614 데이터시트(PDF) 13 Page - Linear Technology

부품명 LTM4614
상세설명  Dual 4A per Channel Low VIN DC/DC 關Module Regulator
PDF  20 Pages
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제조업체  LINER [Linear Technology]
홈페이지  http://www.linear.com
Logo LINER - Linear Technology

LTM4614 데이터시트(HTML) 13 Page - Linear Technology

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LTM4614
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4614fa
Figure 7. 1.2V No Heat Sink (VIN = 5V)
Figure 8. 1.2V Heat Sink (VIN = 5V)
APPLICATIONS INFORMATION
Figure 9. 3.3V No Heat Sink (VIN = 5V)
Figure 10. 3.3V Heat Sink (VIN = 5V)
4.5
2.0
3.0
3.5
4.0
2.5
1.0
1.5
0.5
0
4614 F07
110
50
60
70
80
90
120
100
40
AMBIENT TEMPERATURE (°C)
200LFM NO HEAT SINK
0LFM NO HEAT SINK
400LFM NO HEAT SINK
4.5
2.0
3.0
3.5
4.0
2.5
1.0
1.5
0.5
0
4614 F08
110
50
60
70
80
90
120
100
40
0LFM HEAT SINK
200LFM HEAT SINK
400LFM HEAT SINK
AMBIENT TEMPERATURE (°C)
4.5
2.0
3.0
3.5
4.0
2.5
1.0
1.5
0.5
0
4614 F09
110
50
60
70
80
AMBIENT TEMPERATURE (°C)
90
120
100
40
0LFM NO HEAT SINK
200LFM NO HEAT SINK
400LFM NO HEAT SINK
4.5
2.0
3.0
3.5
4.0
2.5
1.0
1.5
0.5
0
4614 F10
110
50
60
70
80
90
120
100
40
AMBIENT TEMPERATURE (°C)
0LFM HEAT SINK
200LFM HEAT SINK
400LFM HEAT SINK
module temperature rise can be allowed. As an example in
Figure 7 the load current is de-rated to 3A for each chan-
nel with 0LFM at ~ 90°C and the power loss for both
channels at 5V to 1.2V at 3A output are ~1.5 watts. If the
90°C ambient temperature is subtracted from the 120°C
maximum junction temperature, then the difference of
30°C divided 1.5W equals a 20°C/W thermal resistance.
Table 2 specifies a 15°C/W value which is close. Table 2
and Table 3 provide equivalent thermal resistances for
1.2V and 3.3V outputs with and without air flow and
heat sinking. The combine power loss for the two 4A
outputs can be summed together and multiplied by the
thermal resistance values in Tables 2 and 3 for module
temperature rise under the specified conditions. The
printed circuit board is a 1.6mm thick four layer board
with 2 ounce copper for the two outer layers and 1 ounce
copper for the two inner layers. The PCB dimensions are
95mm
× 76mm. The data sheet list the θJP (junction to
pin) and
θJC (junction to case) thermal resistances under
the Pin Configuration diagram.



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