IRC Advanced Film Division

Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Email: afdsales@irctt.com • Website: www.irctt.com

WBC-CR Series Issue April 2006

Wire Bondable

High Range Chip Resistors

Environmental Data

Test

Method

Max

∆R

Typical

∆R

Thermal Shock

MIL-STD-202

Method 107

Test condition F

±0.1%

±0.02%

High Temperature Exposure

MIL-STD-883

Method 1008

150°C, 1000 hours

±0.1%

±0.05%

Low Temperature Storage

-55°C, 1000 hours

±0.03%

±0.01%

Life

MIL-STD-202

Method 108

70°C, 1000 hours

±0.5%

±0.01%

Life at Elevated Temperature

MIL-STD-202

Method 108

125°C, 1000 hours

±0.5%

±0.05%

Prefix

WBC - RO2O2CR

A

S - 01 - 2004 - F

B

Style

R0202CR = Discrete Element

B0202CR = Discrete Element with Back Contact

T0303CR = Tapped Network

Bonding pads

A = Aluminum; G = Gold

Backside

G = Gold; S = Silicon

TCR/Inspection Code

Reference TCR/Inspection Code Table

Total Resistance (R)

4-Digit Resistance Code; Ex: 1014 = 1.01M

Ω; 2004 = 2.0MΩ

Absolute Tolerance Code

K = ±10%; J = ±5%; G = ±2%; F = 1%

Ratio Tolerance Code (T0303 Only)

J = ±5%; G = ±2%; F= ±1%; D = 0.5%

Packaging

Standard packaging is 2˝ x 2˝ chip tray. For additional information or to discuss your

specific requirements, please contact our Applications Team using the contact details below.

Ordering Data

WBC

WBC-CR Series Issue April 2006

WBC-CR Series Issue April 2006