SC628AEVB datasheet(14/21 Pages) SEMTECH

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SC628A

PCB Layout Considerations

The layout diagram in Figure 1 illustrates a proper

two-layer PCB layout for the SC628A and supporting

components.

Following fundamental layout rules is

critical for achieving the performance specified in the

Electrical Characteristics table. The following guidelines

are recommended when developing a PCB layout:

Place all bypass and decoupling capacitors —

C1, C2, CIN, and COUT as close to the device as

possible.

All charge pump current passes through IN,

OUT, and the bucket capacitor connection pins.

Ensure that all connections to these pins make

use of wide traces so that the resistive drop on

each connection is minimized.

The thermal pad should be connected to the

ground plane using multiple vias to ensure

proper thermal connection for optimal heat

transfer.

•

Applications Information (continued)

Make all ground connections to a solid

ground plane as shown in the example layout

(Figure 3).

If a ground layer is not feasible, the following

groupings should be connected:

PGND — CIN, COUT

AGND — Ground Pad

If no ground plane is available, PGND and AGND

should be routed back to the negative battery

terminal as separate signals using thick traces.

•

COUT

CIN

C2-

SDA

SC628A

GND

PGND

Figure 1 — Recommended PCB Layout

Figure 2 — Layer 1

Figure 3 — Layer 2

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