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V

V

V

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AS117 RAD-TOL

AustinSemiconductor,Inc.reservestherighttochangeproductsorspecificationswithoutnotice.

8

AS117 RAD-TOL

Rev. 1.1 06/05

Austin Semiconductor, Inc.

PRELIMINARY SPECIFICATION

ASI Case (Package Designator GW16)

SMD 5962-99517, Case Outline Z

MECHANICAL DEFINITIONS*

*All measurements are in inches.

MIL-STD-1835 outline drawing GDFP1-G16

1. Lead Finish: Solder dipped with Sn 60 or Sn63 solder conforming to MIL-PRF-38535 to a min thickness

of 200 micro-inches. Solder may be applied over lead base metal or Sn plate. Max limit may be increased by

b) a TAB on lead 1, either side.

.003 inches after lead finish applied.

2. Lead 1 identification shall be:

a) A notch or other mark within this area.

Notes:

A

e

A1

b

.004

.009

.015

.022

.013

.017

.037

.043

.050 BSC

.235

.260

.400

.420

.228

.253

.004

.012

.050

.080

Min Max

E1

0

7

e

R

L

0

C

C

b

E

D

A1

A

D

PIN 1

E

E1

R

L

0