DA7905_002.doc

May 6, 2009

2/5

000079051052

ECN 1186

BOND PAD CONFIGURATION

Vs+

Out-

Epi

Out+

GND1

GND2

Important remarks:

As the sensing elements are diffused resistances, the voltage

applied on the ground pads (GND1 and GND2) has to be lower

than the voltage applied on supply voltage pad (Vs+).

The epitaxial layer is connected to the Vs+ pin under the pad.

Gold ball bonding or aluminium wedge bonding can be used to

wire-bond the sensor. The quality of the wire-bonding is equipment

and

process

dependant.

For

this

reason,

it

is

strongly

recommended that a thorough wire-bonding qualification is made

by the end user if the sensor is going to be operated over an

extended temperature range.

LAYOUT (Absolute sensors)

MS7905-A_0.2

MS7905-A_0.5

Pad opening in passivation is 100 µ

µ

µ

µm