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STM8L101F2P3 데이터시트(PDF) 65 Page - STMicroelectronics |
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STM8L101F2P3 데이터시트(HTML) 65 Page - STMicroelectronics |
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65 / 77 page ![]() STM8L101xx Package characteristics Doc ID 15275 Rev 7 65/77 10 Package characteristics 10.1 ECOPACK In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 10.2 Package mechanical data Figure 37. WFQFPN32 - 32-lead very very thin fine pitch quad flat no-lead package outline (5x5)(1)(2) Figure 38. WFQFPN32 recommended footprint(1)(3) 1. Drawing is not to scale. 2. The exposed pad must be soldered to the PCB. It is recommended to connect it to VSS. 3. Dimensions are in millimeters. Seating plane ddd C C A3 A1 A D e 9 16 17 24 32 Pin # 1 ID R = 0.30 8 E L L D2 1 b E2 A0A3_ME Bottom view Table 39. WFQFPN32 - 32-lead very very thin fine pitch quad flat no-lead package (5 x 5), package mechanical data(1) Dim. mm inches(2) Min Typ Max Min Typ Max A(1) 0.70 0.75 0.80 0.0276 0.0295 0.0315 A1 0.00 0.02 0.05 0 0.0008 0.0020 b 0.18 0.23 0.28 0.0071 0.0091 0.0110 D 4.90 5.00 5.10 0.1929 0.1969 0.2008 D2 3.50 0.1378 |
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