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MCP413X 데이터시트(PDF) 83 Page - Microchip Technology

부품명 MCP413X
상세설명  7/8-Bit Single/Dual SPI Digital POT with Volatile Memory
PDF  88 Pages
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제조업체  MICROCHIP [Microchip Technology]
홈페이지  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

MCP413X 데이터시트(HTML) 83 Page - Microchip Technology

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© 2008 Microchip Technology Inc.
DS22060B-page 83
MCP413X/415X/423X/425X
APPENDIX A: REVISION HISTORY
Revision B (December 2008)
The following is the list of modifications:
1.
Updated IPU specifications to specify test
conditions and new limit.
2.
Updated DFN package in “Package Types (top
view)”, including Exposed Thermal Pad sample
(EP).
3.
Added new descriptions in Section 3.0 “Pin
Descriptions”.
4.
Added new Development Tool support items.
5.
Updated Package Outline section.
Revision A (September 2007)
• Original Release of this Document.
APPENDIX B: MIGRATING FROM
THE MCP41XXX AND
MCP42XXX DEVICES
This is intended to give an overview of some of the
differences to be aware of when migrating from the
MCP41XXX and MCP42XXX devices.
B.1
MCP41XXX to MCP41XX
Differences
Here are some of the differences to be aware of:
1.
SI pin is now SDI/SDO pin, and the contents of
the device memory can be read.
2.
Need to address the Terminal Connect Feature
(TCON register) of MCP41XX.
3.
MCP41XX supports software Shutdown mode.
4.
New 5 k
Ω version.
5.
MCP41XX have 7-bit resolution options.
6.
Alternate
pinout
versions
(for
Rheostat
configuration).
7.
Verify device’s electrical specifications.
8.
Interface signals are now high voltage tolerant.
9.
Interface signals now have internal pull-up
resistors.
B.2
MCP42XXX to MCP42XX
Differences
Here are some of the differences to be aware of:
1.
Daisy chaining of devices is no longer
supported.
2.
SDO pin allows contents of device memory to be
read.
3.
Need to address the Terminal Connect Feature
(TCON register) of MCP42XX.
4.
MCP42XX supports software Shutdown mode.
5.
New 5 k
Ω version.
6.
MCP42XX have 7-bit resolution options.
7.
Alternate package/pinout versions (for Rheostat
configuration).
8.
Verify device’s electrical specifications.
9.
Interface signals are now high voltage tolerant
10. Interface signals now have internal pull-up
resistors.



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