© 2009 Microchip Technology Inc.

DS22194A-page 39

MCP661/2/3/5

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office

.

PART NO.

-X

/XX

Package

Temperature

Range

Device

Device:

MCP661

Single Op Amp

MCP661T

Single Op Amp (Tape and Reel)

(SOIC)

MCP662

Dual Op Amp

MCP662T

Dual Op Amp (Tape and Reel)

(DFN and SOIC)

MCP663

Single Op Amp with CS

MCP663T

Single Op Amp with CS (Tape and Reel)

(SOIC)

MCP665

Dual Op Amp with CS

MCP665T

Dual Op Amp with CS (Tape and Reel)

(DFN and MSOP)

Temperature Range: E

= -40°C to +125°C

Package:

MF = Plastic Dual Flat, No Lead (3×3 DFN),

8-lead, 10-lead

SN = Plastic Small Outline (3.90 mm), 8-lead

UN = Plastic Micro Small Outline (MSOP), 10-lead

Examples:

a)

MCP661T-E/SN: Tape and Reel

Extended temperature,

8LD SOIC package

a)

MCP662T-E/MF: Tape and Reel

Extended temperature,

8LD DFN package

b)

MCP662T-E/SN: Tape and Reel

Extended temperature,

8LD SOIC package

a)

MCP663T-E/SN: Tape and Reel

Extended temperature,

8LD SOIC package

a)

MCP665T-E/MF: Tape and Reel

Extended temperature,

10LD DFN package

b)

MCP665T-E/UN: Tape and Reel

Extended temperature,

10LD MSOP package