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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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MPC8533ECHXAAJB 데이터시트(PDF) 79 Page - Freescale Semiconductor, Inc |
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MPC8533ECHXAAJB 데이터시트(HTML) 79 Page - Freescale Semiconductor, Inc |
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79 / 116 page  MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 79 Package Description 18.2 Mechanical Dimensions of the MPC8533E FC-PBGA Figure 55 shows the mechanical dimensions and bottom surface nomenclature of the MPC8533E, 783 FC-PBGA package without a lid. Figure 55. Mechanical Dimensions and Bottom Surface Nomenclature of the MPC8533E FC-PBGA without a Lid Notes: 1. All dimensions are in millimeters. 2. Dimensions and tolerances per ASME Y14.5M-1994. 3. Maximum solder ball diameter measured parallel to datum A. 4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls. 5. Parallelism measurement shall exclude any effect of mark on top surface of package. 6. Capacitors may not be present on all parts. Care must be taken not to short exposed metal capacitor pads. 7. All dimensions are symmetric across the package center lines, unless dimensioned otherwise. |
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