MAX4885AE datasheet(2/10 Pages) MAXIM

2 / 10 page

High-Bandwidth, VGA 2:1 Switch

with ±15kV ESD Protection

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

(All voltages referenced to GND unless otherwise noted.)

VCC..........................................................................-0.3V to +6V

VL.............................................................. -0.3V to (VCC + 0.3V)

R_, G_, B_, H0, V0, SDA0, SCL0 ............. -0.3V to (VCC + 0.3V)

H1, H2, V1, V2, SDA1, SDA2, SCL1,

SCL2, SEL1, SEL2 ................................... -0.3V to (VL + 0.3V)

Continuous Current through R_, G_, B_ Switches.......... Q50mA

Continuous Current through SDA_, SCL_ Switches ...... Q50mA

Continuous Current into SEL1, SEL2, H1, H2, V1, V2 .... Q20mA

Peak Current through all Switches

(pulsed at 1ms, 10% duty cycle)............................... Q100mA

Continuous Power Dissipation (TA = +70NC)

28-Pin TQFN (derate 28.6mW/NC above +70NC)....2285.7mW

Junction-to-Ambient Thermal Resistance (BJA) (Note 1)

28-Pin TQFN.................................................................35NC/W

Junction-to-Ambient Thermal Resistance (BJC) (Note 1)

28-Pin TQFN...................................................................3NC/W

Operating Temperature Range.......................... -40NC to +85NC

Storage Temperature Range............................ -65NC to +150NC

Junction Temperature ................................................... +150NC

Lead Temperature (soldering, 10s) ................................+300NC

ELECTRICAL CHARACTERISTICS

(VCC = +4.5V to +5.5V, VL = +2.2V to VCC, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25NC.)

ABSOLUTE MAXIMUM RATINGS

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to http://www.maxim-ic.com/thermal-

tutorial.

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

Supply Voltage

VCC

+4.5

+5.5

Logic Supply Voltage

VL P VCC

+2.2

VCC

VCC Supply Current

ICC

VCC = +5.5V, VL = +3.6V,

SEL_ = H1 = H2 = V1 = V2 = GND

VL Supply Current

VCC = +5.5V, VL = +3.6V,

SEL_ = H1 = H2 = V1 = V2 = GND

ANALOG SWITCHES

On-Resistance (R_, G_, B_)

R-HF-ON

VIN = +0.7V, IIN = Q10mA

On-Resistance Match (R_, G_,

B_)

RON

0 P VIN P +0.7V, IIN = -10mA

On-Resistance Flatness

(R_, G_, B_)

RFLAT(ON) 0 P VIN P +0.7V, IIN = -10mA

0.5

Off Leakage Current (R_, G_, B_)

IOFF

VR_, VG_, VB_ = 0V or VCC

-1

On-Resistance (SDA_, SCL_)

R-DDCON VIN = +0.7V, IIN = Q10mA

Off-Leakage Current

(SDA_, SCL_)

IOFF

VSDA_, VSCL_ = 0V or VL,

VCC = VL = +5V

-1

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