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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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CPC7591MATR 데이터시트(PDF) 17 Page - Clare, Inc. |
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CPC7591MATR 데이터시트(HTML) 17 Page - Clare, Inc. |
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17 / 19 page  CPC7591 R05 www.clare.com 17 3.2 Printed-Circuit Board Layout 3.2.1 16-Pin SOIC 3.2.2 16-Pin DFN NOTE: As the metallic pad on the bottom of the DFN package is connected to the substrate of the die, Clare recommends that no printed circuit board traces or vias be placed under this area to prevent unintentional shorts. 2.00 (0.079) 1.27 (0.050) mm (inches) DIMENSIONS 9.40 (0.370) 0.60 (0.024) DIMENSIONS mm (inches) 5.80 (0.228) 0.35 (0.014) 1.05 (0.041) 0.80 (0.031) |
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