전자부품 데이터시트 검색엔진
  Korean  ▼
ALLDATASHEET.CO.KR

X  

TLE8366 데이터시트(PDF) 6 Page - Infineon Technologies AG

부품명 TLE8366
상세설명  1.8A DC/DC Step-Down Voltage Regulator
PDF  19 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
제조업체  INFINEON [Infineon Technologies AG]
홈페이지  http://www.infineon.com
Logo INFINEON - Infineon Technologies AG

TLE8366 데이터시트(HTML) 6 Page - Infineon Technologies AG

Back Button TLE8366 Datasheet HTML 2Page - Infineon Technologies AG TLE8366 Datasheet HTML 3Page - Infineon Technologies AG TLE8366 Datasheet HTML 4Page - Infineon Technologies AG TLE8366 Datasheet HTML 5Page - Infineon Technologies AG TLE8366 Datasheet HTML 6Page - Infineon Technologies AG TLE8366 Datasheet HTML 7Page - Infineon Technologies AG TLE8366 Datasheet HTML 8Page - Infineon Technologies AG TLE8366 Datasheet HTML 9Page - Infineon Technologies AG TLE8366 Datasheet HTML 10Page - Infineon Technologies AG Next Button
Zoom Inzoom in Zoom Outzoom out
 6 / 19 page
background image
Data sheet
6
Rev. 1.0, 2009-05-18
TLE8366
General Product Characteristics
4.2
Functional Range
Note: Within the functional range the IC operates as described in the circuit description. The electrical
characteristics are specified within the conditions given in the related electrical characteristics table.
4.3
Thermal Resistance
Pos.
Parameter
Symbol
Limit Values
Unit
Conditions
Min.
Max.
4.2.1
Supply Voltage
V
S
4.75
45
V
–
4.2.2
Output Voltage adjust range
V
CC
0.60
16
V
TLE8366EV
4.2.3
Buck inductor
L
BU
18
56
µH
–
4.2.4
Buck capacitor
C
BU1
33
120
µF
–
4.2.5
Buck capacitor ESR
ESR
BU1
–0.3
Ω
– 1)
1) See section ““Application Information” on Page 14” for loop compensation requirements.
4.2.6
Junction Temperature
T
j
-40
150
°C–
Pos.
Parameter
Symbol
Limit Values
Unit
Conditions
Min.
Typ.
Max.
4.3.1
Junction to Case1)
1) Not subject to production test, specified by design.
R
thJC
–
1012K/W
–
4.3.2
Junction to ambient1)
R
thJA
–52
–
K/W
2)
2) According to Jedec JESD52-1,-5,-7 at natural convection on 2s2p FR4 PCB for 1W power dissipation. PCB
76.2x114.3x1.5mm3 with 2 inner copper layers of 70µm thickness. Thermal via array conected to the first inner copper layer
under the exposed pad.



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19


데이터시트 다운로드

Go To PDF Page


링크 URL



ALLDATASHEET 가 귀하에 도움이 되셨나요?  [ DONATE ] 

Alldatasheet는?   |   광고문의   |   운영자에게 연락하기   |   개인정보취급방침   |   링크 투 데이터시트    |   링크교환   |   제조사별 검색
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com