Analog Integrated Circuit Device Data

Freescale Semiconductor

5

34825

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

Table 2. Maximum Ratings

Exceeding these ratings may cause a malfunction or permanent damage to the device.

Ratings

Symbol

Value

Unit

ELECTRICAL RATINGS

Input Voltage Range

VBUS Pin

OUT Pin

SPK_L, SPK_R, DP, and DM Pins

All Other Pins

-0.3 to 28

-0.3 to 8.0

-0.3 to 5.5

V

ESD Voltage (1)

Human Body Model (HBM) for VBUS, DP, DM, ID Pins

Human Body Model (HBM) for all other pins

Machine Model (MM)

±8000

±2000

±200

V

THERMAL RATINGS

Operating Temperature

Ambient

Junction

-40 to +85

150

°C

Storage Temperature

-65 to +150

°C

Thermal Resistance (2)

Junction-to-Case

Junction-to-Ambient

6.0

45

°C/W

Peak Package Reflow Temperature During Reflow (3), (4)

Note 4

°C

Notes

1.

2.

Device mounted on the Freescale EVB test board per JEDEC DESD51-2.

3.

Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may

cause malfunction or permanent damage to the device.

4.

Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow

Temperature and Moisture Sensitivity Levels (MSL), go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and

enter the core ID to view all orderable parts (i.e. MC33xxxD enter 33xxx)], and review parametrics.