Pin Description

Pin Name

I/O

ROM Code

Option

Description

PA0~PA7

I/O

Wake-up*

Pull-high***

Bidirectional 8-bit input/output port. Each bit can be configured as a wake-up in-

put by a option. Software instructions determine the CMOS output or Schmitt trig-

ger input with/without pull-high resistor. The pull-high resistor of each input/output

line is also optional.

PB0/PFD

PB1~PB7

I/O

Pull-high**

PB0 or PFD

Bidirectional 8-bit input/output port. Software instructions determine the CMOS

output or Schmitt trigger input with/without pull-high resistor. The pull-high resis-

tor of each input/output line is also optional. The output mode of PB0 can be

used as an internal PFD signal output and it can be used as a various frequency

carrier signal.

PC0/TMR0

PC1~PC4

PC5/TMR1

I/O

Pull-high*

Bidirectional 6-bit input/output port. Software instructions determine the CMOS

output or Schmitt trigger input with/without pull-high resistor. The pull-high resis-

tor of each input/output line is also optional. PC0 and PC5 are pin shared with

TMR0 and TMR1 function pins.

PF0/INT

I/O

Pull-high*

Bidirectional 1-bit input/output port. Software instructions determine the CMOS

output or Schmitt trigger input with/without pull-high resistor. The pull-high resis-

tor of this input/output line is also optional. PF0 is pin shared with the INT func-

tion pin.

OSC1

OSC2

I

O

Crystal

or RC

OSC1, OSC2 are connected to an RC network or Crystal (determined by option)

for the internal system clock. In the case of RC operation, OSC2 is the output

terminal for 1/4 system clock.

RES

I

¾

Schmitt trigger reset input, active low.

VSS

¾¾

Negative power supply, ground

VDD

¾¾

Positive power supply

Note:

* Bit option

** Nibble option

*** Byte option

Absolute Maximum Ratings

Storage Temperature ............................

-50°Cto125°C

Operating Temperature...........................

-40°Cto85°C

-100mA

Total Power Dissipation .....................................500mW

Note: These are stress ratings only. Stresses exceeding the range specified under

²Absolute Maximum Ratings² may

cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed

in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability.

HT48RA5/HT48CA5

Rev. 1.40

3

May 22, 2009