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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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MPC8535EBVTANG 데이터시트(PDF) 123 Page - Freescale Semiconductor, Inc |
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MPC8535EBVTANG 데이터시트(HTML) 123 Page - Freescale Semiconductor, Inc |
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123 / 126 page  Mechanical Dimensions of the MPC8535E FC-PBGA MPC8535E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 2 Freescale Semiconductor 123 5.2 Mechanical Dimensions of the MPC8535E FC-PBGA The mechanical dimensions and bottom surface nomenclature of the MPC8535E, 783 FC-PBGA package are shown in Figure 81. Figure 81. Mechanical Dimensions and Bottom Surface Nomenclature of the MPC8535E FC-PBGA NOTES for Figure 81 1. All dimensions are in millimeters. 2. Dimensions and tolerances per ASME Y14.5M-1994. 3. Maximum solder ball diameter measured parallel to datum A 4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls. 5. Capacitors may not be present on all devices 6. Caution must be taken not to short exposed metal capacitor pads on package top. 7. All dimensions are symmetric across the package center lines, unless dimensioned otherwise. |
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