Cautions and warnings General

See "Important notes" at the end of this document.

Storage

Store thermistors only in original packaging. Do not open the package prior to storage.

Storage conditions in original packaging: storage temperature

25

°C ... +45 °C, relative

humidity

≤75% annual mean, <95% maximum 30 days per annum, dew precipitation is

inadmissible.

Do not store thermistors where they are exposed to heat or direct sunlight. Otherwise, the

packing material may be deformed or components may stick together, causing problems during

mounting.

Avoid contamination of thermistor surface during storage, handling and processing.

Use the components as soon as possible after opening the factory seals, i.e. the

polyvinyl-sealed packages.

Solder thermistors within the time specified after shipment from EPCOS.

For leaded components this is 24 months, for SMDs 12 months.

Handling

NTC thermistors must not be dropped. Chip-offs or any other damage must not be caused

during handling of NTCs.

Do not touch components with bare hands. Gloves are recommended.

Avoid contamination of thermistor surface during handling.

Bending / twisting leads

A lead (wire) may be bent at a minimum distance of twice the wire’s diameter plus 4 mm from

the component head or housing. When bending ensure the wire is mechanically relieved at the

component head or housing. The bending radius should be at least 0.75 mm.

Twisting (torsion) by 180

° of a lead bent by 90° is permissible at 6 mm from the bottom of the

thermistor body.

Soldering

Use resin-type flux or non-activated flux.

Insufficient preheating may cause ceramic cracks.

Rapid cooling by dipping in solvent is not recommended.

Complete removal of flux is recommended.

Temperature measurement

B57504K

Probe assemblies

K504

Page 5 of 9

Please read Cautions and warnings and

Important notes at the end of this document.