Lineage Power

13

Data Sheet

March 27, 2008

36-75 Vdc Input; 3.3 Vdc and 5 Vdc Outputs; 30 W

JBW030-Series Power Module: dc-dc Converters

8-1052(C).a

Figure 22. Case-to-Ambient Thermal Resistance

vs. Air Velocity Curves; Either

Orientation

Although the previous example uses 100 °C as the

maximum case temperature, for extremely high reliabil-

ity applications, one can use a lower temperature for

It is important to point out that the thermal resistances

shown in Figure 22 are for heat transfer from the sides

and bottom of the module as well as the top side with

the attached heat sink; therefore, the case-to-ambient

thermal resistances shown will generally be lower than

the resistance of the heat sink by itself. The data in Fig-

ure 22 was taken with a thermally conductive dry pad

between the case and the heat sink to minimize contact

resistance (typically 0.1 °C/W to 0.3 °C/W).

For a more detailed explanation of thermal energy

management for this series of power modules as well

as more details on available heat sinks, please request

the following technical note: Thermal Energy Manage-

ment for JC- and JW-Series 30 Watt Board-Mounted

Power Modules (TN97-016EPS).

Layout Considerations

Copper paths must not be routed beneath the power

module standoffs.

0

0.25

(50)

0.51

(100)

0.76

(150)

1.02

(200)

1.78

(350)

2.03

(400)

0

5

6

7

8

4

3

2

1

1.27

(250)

1.52

(300)

NO HEAT SINK

1/4 in. HEAT SINK

1/2 in. HEAT SINK

1 in. HEAT SINK

1 1/2 in. HEAT SINK