SL1608□□□□L□-□□□

D : 0.4 typ.

C : 0.8±0.2

B : 0.8±0.2

A : 1.6±0.2

2.7

0.9

SPECIFICATION FOR APPROVAL

Time ( seconds )

150

( PCB Pattern )

c﹒Terminal：Solder coat over Ni plate (Lead content 100ppm max.)

Ⅳ﹒

GENERAL SPECIFICATION：

AR-001A

e﹒Resistance to solder heat：260℃.10 secs.

b﹒Rated current：Current cause inductance

e﹒Remark：Products comply with RoHS'

c﹒Storage temp.：-40℃ ----+125℃

d﹒Operating temp.：-40℃----+105℃

drop within 10% max.

a﹒Temp rise ：15℃ max

d﹒Coating：Epoxy resin

requirements

100

0

50

250

150

200

100

50

Max time above 200℃ ：70sec max.

Max time above 230℃ ：50sec max.

Peak Temp：260℃ max.

+4.0

/ sec max.

℃

Rising Area

Temperature

150 ~ 200

/ 60 ~ 120sec

℃

Preheat Area

d

NAME

PROD.

Ⅲ﹒

MATERIALS：

Ⅱ﹒

SCHEMATIC DIAGRAM：

Ⅰ﹒

CONFIGURATION & DIMENSIONS：

REF :

0.9

B

D

D

b﹒Wire ：Copper

a﹒Core：Ceramic

WOUND CHIP INDUCTOR

A

ABC'S ITEM NO.

ABC'S DWG NO.

Peak Temperature:

200

250

70sec max.

50sec max.

260

℃

230

℃

-(1.0 ~ 5.0)

/ sec max.

℃

Forced Cooling Area

Reflow Area

/ sec max.

+2.0 ~ 4.0℃

b

0.9

c

a

m/m

m/m

m/m

m/m

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