| 전자부품 데이터시트 검색엔진 |
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SP10451R4ML 데이터시트(PDF) 1 Page - ABC Taiwan Electronics Corp |
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SP10451R4ML 데이터시트(HTML) 1 Page - ABC Taiwan Electronics Corp |
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1 / 8 page ![]() E1: 1.00 typ. B : 9.35±0.30 C : 4.50±0.30 D : 2.10 typ. E : 2.00 typ. A : 11.00±0.30 F : 6.00 typ. E2: 1.50 typ. Time ( seconds ) SP1045□□□□L□-□□□ SPECIFICATION FOR APPROVAL Ⅲ﹒MATERIALS LIST: Ⅳ﹒GENERAL SPECIFICATION: AR-001A f﹒Remark:Products comply with RoHS' ( Temp. rise included ) c﹒Resistance to solder heat:260℃. 10 secs. requirements a﹒Storage temp.:-55℃ ~ +135℃ b﹒Operating temp .:-55℃ ~ +135℃ Enamelled copper wire a﹒Core:Ferrite ER core b﹒Base:UL 94V-0 c﹒Wire:Ultra-fine rectangular e﹒Adhesive:Epoxy resin d﹒Clip:Cu / Ni / Sn 100 0 50 150 250 200 50 100 Rising Area Temperature +4.0 / sec max. ℃ Peak Temp:260℃ max. Max time above 230℃ :50sec max. Max time above 200℃ :70sec max. Preheat Area 1 50 ~ 200 / 60 ~ 120sec ℃ d e Black Mass-prod. Ⅱ﹒SCHEMATIC DIAGRAM: Ⅰ﹒MECHANICAL DIMENSIONS: PROD. NAME REF : 1 2 E1 E 1.4 10.0 2.8 5.8 POWER INDUCTOR B SHIELDED SMD C ABC'S DWG No. ABC'S ITEM No. c 260 ℃ 250 200 150 50sec m ax. 70s ec m ax. 230 ℃ -(1.0 ~ 5.0) / sec max. ℃ Forced Coolin g Area Reflow Area +2.0 ~ 4.0℃ / sec max. Peak Tem perature: b m/m a m/m m/m m/m m/m m/m m/m m/m PAGE: 1 20091104-A |
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