54

For

SD Memory

Card

For

microSD™

Card

For

SIM Card

8pins

For

W-SIM

For

Memory

Stick Micro™

Combine Type

For

Express

Card™

For

Compact

Flash™

For PC cards

supporting

CardBus

For CMOS

Camera Module

For

Memory

Stick™

Soldering Conditions

Example of Reflow Soldering Condition

（Reference）

1. Heating method: Double heating method with infrared heater.

2. Temperature measurement: Thermocouple 0.1 to 0.2

φ CA（K）or CC（T）.

3. Temperature profile.

Cautions for using this product

1. When soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or

electrical degradation to occur depending on the conditions. Caution is therefore required.

2. When soldering, do not use water soluble flux because this may corrode the product.

3. Regarding the setting of reflow conditions, please confirm them with the actual mass production conditions.

4. As PC board warping may alter characteristics, please take this into consideration when designing pattern and

layout.

200

100

240

℃(max.)

230

℃(min.)

150

℃

180

℃

Time (s)

10 sec.(max.)

90

±30 sec.

Room

temperature

Pre-heating

Heating time

sec.

Connector for Connection with PC Cards Supporting CardBus