108

Horizontal

Type

Vertical

Type

Detector

Push

Slide

Rotary

Encoders

Power

Dual-in-line

Package Type

TACT Switch

TM

Custom-

Products

Soldering Conditions

Example of Reflow Soldering Condition

1. Heating method: Double heating method with infrared heater.

2. Temperature measurement: Thermocouple 0.1 to 0.2

φ CA (K) or CC (T) at soldering portion (copper foil surface). A heat resisting tape

should be used for fixed measurement.

3. Temperature profile

300

200

100

A max.

B

E

D

Time (s)

C

Pre-heating

F max.

Room

temperature

1. The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where

the PC board's temperature greatly differs from that of the switch, depending on the PC board's material, size,

thickness, etc. The above-stated conditions shall also apply to switch surface temperatures.

2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is

highly recommended.

Notes

Series

（Reflow type）

SPEE

SPEF, SPEG

230

40

180

150

120

260

A

（℃）

3s max.

B

（℃）

C

（s）

D

（℃）

E

（℃）

F

（s）

Push Switches