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AS1325

Data Sheet - A b s o l u t e M a x i m u m R a t i n g s

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only,

and functional operation of the device at these or any other conditions beyond those indicated in Section 6 Electrical

Characteristics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may

affect device reliability.

Table 2. Absolute Maximum Ratings

Parameter

Min

Max

Units

Comments

All Pins to GND

-0.3

7

V

LX Current

1

A

Latch-Up

-100

100

mA

JEDEC 78

Package Power Dissipation

500

mW

(

Operating Temperature Range

-40

+85

ºC

Electrostatic Discharge

-500

+500

V

HBM MIL-Std. 883E 3015.7 methods

Humidity (Non-Condensing)

5

85

%

Storage Temperature Range

-55

125

ºC

Junction Temperature

150

ºC

Package Body Temperature

260

ºC

The reflow peak soldering temperature (body

temperature) specified is in compliance with

IPC/JEDEC J-STD-020C “Moisture/ Reflow

Sensitivity Classification for Non-Hermetic

Solid State Surface Mount Devices”.