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Revision 1.03

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AS1361/AS1362

Datasheet - P a c k a g e D r a w i n g s a n d M a r k i n g s

10 Package Drawings and Markings

The devices are available in a TSOT23 6-pin package.

Figure 19. TSOT23 6-pin Package

Notes:

1. Dimensioning and tolerancing conform to ASME Y14.5M - 1994.

2. Dimensions are in millimeters.

3. Dimension D does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, and gate burrs shall

not exceed 0.15mm per end. Dimension E1 does not include interlead flash or protrusion. Interlead flash or pro-

trusion shall not exceed 0.15mm per side. Dimensions D and E1 are determined at datum H.

4. The package top can be smaller than the package bottom. Dimensions D and E1 are determined at the outer-

most extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs, and interlead flash, but

include any mistmatches between the top of the package body and the bottom. D and E1 are determined at

datum H.

Symbol

Min

Typ

Max

Notes

Symbol

Min

Typ

Max

Notes

A

1.00

L

0.30

0.40

0.50

A1

0.01

0.05

0.10

L1

0.60REF

A2

0.84

0.87

0.90

L2

0.25BSC

b

0.30

0.45

N

6

b1

0.31

0.35

0.39

R

0.10

c

0.12

0.15

0.20

R1

0.10

0.25

c1

0.08

0.13

0.16

θ

0º

4º

8º

D

2.90BSC

3,4

4º

10º

12º

E

2.80BSC

3,4

Tolerances of Form and Position

E1

1.60BSC

3,4

aaa

0.15

e

0.95BSC

bbb

0.25

e1

1.90BSC

ccc

0.10

ddd

0.20