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Revision 2.1

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AS8202NF TTP-C2NF

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 3 may cause permanent damage to the device. These are stress ratings only.

Functional operation of the device at these or any other conditions beyond those indicated in Section 6 Electrical

Characteristics on page 7 is not implied. Exposure to absolute maximum rating conditions for extended periods may

affect device reliability.

Table 3. Absolute Maximum Ratings

Parameter

Min

Max

Units

Notes

5.0

V

V

any pin

-100

100

mA

-55

150

ºC

235

ºC

t=10 sec, Reflow and Wave

240

ºC

1

1. The reflow peak soldering temperature (body temperature) specified is in accordance with IPC/JEDEC J-STD-

020C “Moisture/Reflow Sensitivity Classification for Non-Hermetic Solid State Surface Mount Devices”. The lead

finish for packages is (85%/15% Sn/Pb).

Humidity (H)

5

85

%

Electrostatic Discharge (ESD)

1000

V

HBM: 1KV Mil.std.883, Method 3015.7