MCP1825-0802ESLASHAB datasheet(9/38 Pages) MICROCHIP

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DS22056B-page 9

MCP1825/MCP1825S

Power Supply Ripple Rejection

Ratio

PSRR

—

f = 100 Hz, COUT = 4.7 µF,

IOUT = 100 µA,

VINAC = 100 mV pk-pk,

CIN = 0 µF

Thermal Shutdown Temperature

TSD

—

150

—

°C

IOUT = 100 µA, VOUT = 1.8V,

VIN = 2.8V

Thermal Shutdown Hysteresis

ΔT

—10

—

°C

IOUT = 100 µA, VOUT = 1.8V,

VIN = 2.8V

AC/DC CHARACTERISTICS (CONTINUED)

Electrical Specifications: Unless otherwise noted, V

IN = VOUT(MAX) + VDROPOUT(MAX), Note 1, VR = 1.8V for Adjustable Output,

IOUT = 1 mA, CIN = COUT = 4.7 µF (X7R Ceramic), TA = +25°C.

Boldface type applies for junction temperatures, T

J (Note 7) of -40°C to +125°C

Parameters

Sym

Min

Typ

Max

Units

Conditions

Note 1:

The minimum VIN must meet two conditions: VIN ≥ 2.1V and VIN ≥ VOUT(MAX) + VDROPOUT(MAX).

VR is the nominal regulator output voltage for the fixed cases. VR = 1.2V, 1.8V, etc. VR is the desired set point output

voltage for the adjustable cases. VR = VADJ * ((R1/R2)+1). Figure 4-1.

TCVOUT = (VOUT-HIGH – VOUT-LOW) *10

6 / (V

R * ΔTemperature). VOUT-HIGH is the highest voltage measured over the

temperature range. VOUT-LOW is the lowest voltage measured over the temperature range.

Load regulation is measured at a constant junction temperature using low duty-cycle pulse testing. Load regulation is

tested over a load range from 1 mA to the maximum specified output current.

Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its

nominal value that was measured with an input voltage of VIN = VOUT(MAX) + VDROPOUT(MAX).

The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction

temperature and the thermal resistance from junction to air. (i.e., TA, TJ, θJA). Exceeding the maximum allowable power

dissipation will cause the device operating junction temperature to exceed the maximum +150°C rating. Sustained

junction temperatures above 150°C can impact device reliability.

The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the

desired junction temperature. The test time is small enough such that the rise in the junction temperature over the

ambient temperature is not significant.

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