CYStech Electronics Corp.

Spec. No. : C344SC

Issued Date : 2003.10.29

Revised Date :

Page No. : 3/3

CSMC30XSC

CYStek Product Specification

SMC/DO-214AB Dimension

*:Typical

Inches

Millimeters

Inches

Millimeters

DIM

Min.

Max.

Min.

Max.

DIM

Min.

Max.

Min.

Max.

A

0.260

0.276

6.6

7.0

E

0.228

0.244

5.8

6.2

B

0.173

0.189

4.4

4.8

F

0.071

0.087

1.8

2.2

C

0.012(typ)

0.3(typ)

G

0.032(typ)

0.8(typ)

D

0.144

0.152

3.6

3.8

H

0.04(typ)

1.0(typ)

2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.

Material :

• Lead : 42 Alloy ; solder plating

• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.

• CYStek reserves the right to make changes to its products without notice.

• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.

SMC/DO-214AB Plastic

Surface Mounted Package

CYStek Package Code: SC

Marking Code:

Device CSMC

301

CSMC

302

CSMC

303

CSMC

304

Code

A31

A32

A33

A34

Device CSMC

305

CSMC

306

CSMC

307

Code

A35

A36

A37