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NCP1237 데이터시트(PDF) 4 Page - ON Semiconductor

부품명 NCP1237
상세설명  Fixed Frequency Current Mode Controller for Flyback Converters
PDF  34 Pages
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제조업체  ONSEMI [ON Semiconductor]
홈페이지  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

NCP1237 데이터시트(HTML) 4 Page - ON Semiconductor

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NCP1237
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4
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Supply Pin (pin 6) (Note 2)
Voltage range
Current range
VCCMAX
ICCMAX
–0.3 to 28
$30
V
mA
High Voltage Pin (pin 8) (Note 2)
Voltage range
Current range
VHVMAX
IHVMAX
–0.3 to 500
$20
V
mA
Driver Pin (pin 5) (Note 2)
Voltage range
Current range
VDRVMAX
IDRVMAX
–0.3 to 20
$1000
V
mA
All other pins (Note 2)
Voltage range
Current range
VMAX
IMAX
–0.3 to 10
$10
V
mA
Thermal Resistance SOIC−7
Junction−to−Air, low conductivity PCB (Note 3)
Junction−to−Air, medium conductivity PCB (Note 4)
Junction−to−Air, high conductivity PCB (Note 5)
RqJA
162
147
125
°C/W
Temperature Range
Operating Junction Temperature
Storage Temperature Range
TJMAX
TSTRGMAX
−40 to +150
−60 to +150
°C
ESD Capability (Note 1)
Human Body Model (HBM) Model (All pins except HV)
Machine Model (MM)
2000
190
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. This device series contains ESD protection and exceeds the following tests:
Human Body Model 2000 V per JEDEC standard JESD22, Method A114E
Machine Model Method 200 V per JEDEC standard JESD22, Method A115A
2. This device contains latch−up protection and exceeds 100 mA per JEDEC Standard JESD78
3. As mounted on a 80 x 100 x 1.5 mm FR4 substrate with a single layer of 100 mm2of 1 oz copper traces and heat spreading area. As specified
for a JEDEC 51−1 conductivity test PCB. Test conditions were under natural convection or zero air flow.
4. As mounted on a 80 x 100 x 1.5 mm FR4 substrate with a single layer of 100 mm2of 2 oz copper traces and heat spreading area. As specified
for a JEDEC 51−2 conductivity test PCB. Test conditions were under natural convection or zero air flow.
5. As mounted on a 80 x 100 x 1.5 mm FR4 substrate with a single layer of 650 mm2of 1 oz copper traces and heat spreading area. As specified
for a JEDEC 51−3 conductivity test PCB. Test conditions were under natural convection or zero air flow.



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