33905 datasheet(13/91 Pages) FREESCALE

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Analog Integrated Circuit Device Data

Freescale Semiconductor

33904/5

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

ESD Capability

* AECQ100(1)

Human Body Model - JESD22/A114 (CZAP = 100 pF, RZAP = 1500 Ω)

CANH and CANL. LIN1 and LIN2, Pins versus all GND pins

all other Pins including CANH and CANL

Charge Device Model - JESD22/C101 (CZAP = 4.0 pF)

Corner Pins (Pins 1, 16, 17, and 32)

All other Pins (Pins 2-15, 18-31)

* According to IEC 61000-4-2 (CZAP = 150 pF, RZAP = 330 Ω)

device unpowered, CANH and CANL pin without capacitor, versus GND

device unpowered, LIN pin, versus GND

device unpowered, VS1/VS2 (100 nF to GND), versus GND

* According to “OEM_HW_Requirements_For_CAN_LIN_FR-Interfaces_V1

0_20081210.pdf”

CANH, CANL without bus filter

LIN with and without bus filter

I/O with external components (22k - 10nF)

VESD1-1

VESD1-2

VESD2-1

VESD2-2

VESD3-1

VESD3-2

VESD3-3

VESD4-1

VESD4-2

VESD4-3

±8000

±2000

±750

±500

±15000

±9000

±12000

±7000

THERMAL RATINGS

Junction temperature

150

°C

Ambient temperature

-40 to 125

°C

Storage temperature

TST

-55 to 165

°C

THERMAL RESISTANCE

Thermal resistance junction to ambient

RθJA

50(4)

°C/W

Peak Package Reflow Temperature During Reflow(2), (3)

TPPRT

Note 3

°C

Notes

ESD testing is performed in accordance with the Human Body Model (HBM) (CZAP = 100 pF, RZAP = 1500 Ω) and the Charge Device

Model (CDM), Robotic (CZAP = 4.0 pF).

The voltage on non-Vsup pins should never exceed the Vsup voltage at any time or permanent damage to the device may occur.Pin

soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may

cause malfunction or permanent damage to the device.

Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow

Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes

and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.

This parameter was measured according to Figure 8 below:

Figure 8. PCB with Top and Bottom Layer Dissipation Area (Dual Layer)

Table 3. Maximum Ratings (continued)

All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or

permanent damage to the device.

Ratings

Symbol

Value

Unit

PCB 100mm x 100mm

Bottom side

20mm x 40mm

Top side, 300 sq. mm

(20mmx15mm)

Bottom view

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