LT6201CS8 datasheet(22/26 Pages) LINER

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LT6200/LT6200-5

LT6200-10/LT6201

62001fd

APPLICATIONS INFORMATION

200°C/W, θJA. Operating on ± 5V supplies driving 50Ω

loads, the worst-case power dissipation is given by:

PD(MAX) = (10 • 23mA) + (2.5)2/50

= 0.23 + 0.125 = 0.355W

The maximum ambient temperature that the part is

allowed to operate is:

TA = TJ – (PD(MAX) • 200°C/W)

= 150°C – (0.355W • 200°C/W) = 79°C

To operate the device at a higher ambient temperature,

connect more metal area to the V – pin to reduce the thermal

resistance of the package, as indicated in Table 1.

DD Package Heat Sinking

The underside of the DD package has exposed metal

(4mm2) from the lead frame where the die is attached.

This provides for the direct transfer of heat from the die

junction to printed circuit board metal to help control the

maximum operating junction temperature. The dual-in-line

pin arrangement allows for extended metal beyond the

ends of the package on the topside (component side) of

a PCB. Table 2 summarizes the thermal resistance from

the die junction-to-ambient that can be obtained using

various amounts of topside metal (2oz copper) area. On

multilayer boards, further reductions can be obtained using

additional metal on inner PCB layers connected through

vias beneath the package.

Table 2. LT6200 8-Lead DD Package

COPPER AREA

TOPSIDE (mm2)

THERMAL RESISTANCE

(JUNCTION-TO-AMBIENT)

160ºC/W

135ºC/W

110ºC/W

95ºC/W

130

70ºC/W

The LT6200 ampliﬁer family has thermal shutdown to

protect the part from excessive junction temperature.

The ampliﬁer will shut down to approximately 1.2mA

supply current per ampliﬁer if the maximum temperature

is exceeded. The LT6200 will remain off until the junction

temperature reduces to about 135°C, at which point the

ampliﬁer will return to normal operation.

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