For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com

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Outline Drawing

Part Number

Package Body Material

Lead Finish

MSL Rating

Package Marking

[1]

HMC765LP6CE

RoHS-compliant Low Stress Injection Molded Plastic

100% matte Sn

MSL3

H765

XXXX

[1] 4-Digit lot number XXXX

Package Information

NOTES:

1. LEADFRAME MATERIAL: COPPER ALLOY

2. DIMENSIONS ARE IN INCHES [MILLIMETERS].

3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE

4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.

PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.

5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.

6. ALL GROUND LEADS AND GROUND PADDLE MUST

BE SOLDERED TO PCB RF GROUND.

7. REFER TO HITTITE APPLICATION NOTE FOR

SUGGESTED PCB LAND PATTERN.

Absolute Maximum Ratings

Nominal 3.3V Supplies to GND

-0.3V to +3.6V

Nominal Digital Supply Relative to

3.3V Analog Supply

-0.3V to +0.3V

Nominal 5V Supply to GND

-0.3 to +5.5V

Vtune

0 to +15V

Storage Temperature

-65 to +150°C

Max Peak Reflow Temperature

260 °C

ESD Sensitivity (HBM)

Class 1A

Reliability Information

Junction Temperature to Maintain

1 Million Hour MTTF

135 °C

Nominal Junction Temperature (T=85 °C)

132 °C

Thermal Resistance

(Junction to GND Paddle, 5V Supply)

38.4 °C/W

Operating Temperature

-40 to +85°C

HMC765LP6CE

v02.0110

FRACTIONAL-N SYNTHESIZER WITH

INTEGRATED VCO, 7.8 - 8.8 GHz